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Fundamentals of microsystems packaging Tummala Rao R.

By: Material type: TextTextPublication details: New York McGraw-Hill's AccessEngineering 2001Description: 967PISBN:
  • 9780071371698
DDC classification:
  • 621.381 RAO
Contents:
Introduction to microsystems packaging Role of packaging in microelectronics Role of packaging in microsystems Fundamentals of electrical package design Fundamentals of design for reliability Fundamentals of thermal management Fundamentals of single chip packaging Fundamentals of multichip packaging Fundamentals of IC assembly Fundamentals of wafer-level packaging Fundamentals of passives: discrete, integrated, and embedded Fundamentals of optoelectronics Fundamentals of RF packaging Fundamentals of microelectromechanical systems Fundamentals of sealing and encapsulation Fundamentals of system-level PWB technologies Fundamentals of board assembly Fundamentals of packaging materials and processes Fundamentals of electrical testing Fundamentals of packaging manufacturing Fundamentals of microsystems design for environment Fundamentals of microsystems reliability
Summary: A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapte
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Reference Reference IIITDM Kurnool Reference Reference 621.381 RAO (Browse shelf(Opens below)) Not For Loan 0006197

Introduction to microsystems packaging
Role of packaging in microelectronics
Role of packaging in microsystems
Fundamentals of electrical package design
Fundamentals of design for reliability
Fundamentals of thermal management
Fundamentals of single chip packaging
Fundamentals of multichip packaging
Fundamentals of IC assembly
Fundamentals of wafer-level packaging
Fundamentals of passives: discrete, integrated, and embedded
Fundamentals of optoelectronics
Fundamentals of RF packaging
Fundamentals of microelectromechanical systems
Fundamentals of sealing and encapsulation
Fundamentals of system-level PWB technologies
Fundamentals of board assembly
Fundamentals of packaging materials and processes
Fundamentals of electrical testing
Fundamentals of packaging manufacturing
Fundamentals of microsystems design for environment
Fundamentals of microsystems reliability

A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapte

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