Fundamentals of microsystems packaging (Record no. 2375)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 01606nam a22001697a 4500 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20240827111007.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 240827b |||||||| |||| 00| 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780071371698 |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381 |
| Item number | RAO |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Rao R. Tummala |
| 245 ## - TITLE STATEMENT | |
| Title | Fundamentals of microsystems packaging |
| Statement of responsibility, etc. | Tummala Rao R. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. | |
| Place of publication, distribution, etc. | New York |
| Name of publisher, distributor, etc. | McGraw-Hill's AccessEngineering |
| Date of publication, distribution, etc. | 2001 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Page number | 967P |
| 505 ## - FORMATTED CONTENTS NOTE | |
| Title | Introduction to microsystems packaging<br/>Role of packaging in microelectronics<br/>Role of packaging in microsystems<br/>Fundamentals of electrical package design<br/>Fundamentals of design for reliability<br/>Fundamentals of thermal management<br/>Fundamentals of single chip packaging<br/>Fundamentals of multichip packaging<br/>Fundamentals of IC assembly<br/>Fundamentals of wafer-level packaging<br/>Fundamentals of passives: discrete, integrated, and embedded<br/>Fundamentals of optoelectronics<br/>Fundamentals of RF packaging<br/>Fundamentals of microelectromechanical systems<br/>Fundamentals of sealing and encapsulation<br/>Fundamentals of system-level PWB technologies<br/>Fundamentals of board assembly<br/>Fundamentals of packaging materials and processes<br/>Fundamentals of electrical testing<br/>Fundamentals of packaging manufacturing<br/>Fundamentals of microsystems design for environment<br/>Fundamentals of microsystems reliability |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapte |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | Dewey Decimal Classification |
| Koha item type | Books |
| 952 ## - LOCATION AND ITEM INFORMATION (KOHA) | |
| -- | 7231 |
| Withdrawn status | Lost status | Source of classification or shelving scheme | Damaged status | Not for loan | Collection code | Home library | Current library | Shelving location | Date acquired | Source of acquisition | Cost, normal purchase price | Inventory number | Total Checkouts | Full call number | Barcode | Date last seen | Cost, replacement price | Price effective from | Currency | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Dewey Decimal Classification | Not For Loan | Reference | IIITDM Kurnool | IIITDM Kurnool | Reference | 27.08.2024 | New India Book Agency | 487.00 | 5316 dt 16/7/2024 | 621.381 RAO | 0006197 | 27.08.2024 | 487.00 | 27.08.2024 | USD | Reference |