000			01606nam a22001697a 4500
005			20240827111007.0
008			240827b |||||||| |||| 00| 0 eng d
020			_a9780071371698
082			_a621.381 _bRAO
100			_aRao R. Tummala
245			_a Fundamentals of microsystems packaging _c Tummala Rao R.
260			_a New York _bMcGraw-Hill's AccessEngineering _c2001
300			_a967P
505			_tIntroduction to microsystems packaging Role of packaging in microelectronics Role of packaging in microsystems Fundamentals of electrical package design Fundamentals of design for reliability Fundamentals of thermal management Fundamentals of single chip packaging Fundamentals of multichip packaging Fundamentals of IC assembly Fundamentals of wafer-level packaging Fundamentals of passives: discrete, integrated, and embedded Fundamentals of optoelectronics Fundamentals of RF packaging Fundamentals of microelectromechanical systems Fundamentals of sealing and encapsulation Fundamentals of system-level PWB technologies Fundamentals of board assembly Fundamentals of packaging materials and processes Fundamentals of electrical testing Fundamentals of packaging manufacturing Fundamentals of microsystems design for environment Fundamentals of microsystems reliability
520			_aA rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapte
942			_2ddc _cBK
999			_c2375 _d2375