000			01351nam a22001817a 4500
005			20240827110227.0
008			240827b |||||||| |||| 00| 0 eng d
020			_a9780070371354
082			_a621.381 _bLAU
100			_a John H. Lau
245			_aElectronic Packaging: Design, Materials, Process, and Reliability _c John H. Lau
260			_aU.S _bMcGraw-Hill Professional _c1998
300			_a498 p
505			_tElectrical design; analysis and measurement of electronic packaging and interconnections; basic electrical effects; transmission line behaviour; power and ground bus disturbances; design examples; thermal design, analysis and measurement of electronics packaging and interconnections; principles of heat transfer; thermal analysis and design; hardware components for cooling; measurement perspectives; mechanical design, analysis and measurement; thermal strains; mechanical strains; BGA; SCP; Flip Chip; materials and processes for electronics packaging and interconnection.
520			_aIntended to be an electronic packaging resource, this text features writing from four leaders in the the four intertwined disciplines of packaging. Recent technological advances are discussed, including BGA, Flip Chip and CSP.
650			_a DESIGN ELECTRONIC EQUIPMENT ELECTRONIC PACKAGING Electronic packaging MATERIALS
942			_2ddc _cBK
999			_c2374 _d2374