000			01357nam a22001817a 4500
005			20240627163047.0
008			240627b |||||||| |||| 00| 0 eng d
020			_a9780471466093
082			_a621.381 _bULR
100			_aRichard K. Ulrich, William D. Brown
245			_a Advanced electronic packaging _cRichard K. Ulrich, William D. Brown
250			_a2
260			_aHoboken, NJ, [Chichester] , _bWiley-Interscience/IEEE ; [John Wiley distributor] , _c©2006
300			_axxvi, 812 pages : _bllustrations ; _c26 cm.
505			_tCIRCUITS Electronic packaging MICROELECTRONICS MICROMODULES Microelectronic packaging
520			_a"As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department."--Publisher's website
942			_2ddc _cBK
999			_c2288 _d2288