000			01015nam a22001937a 4500
005			20220901102859.0
008			220901b |||||||| |||| 00| 0 eng d
020			_a9781630818609
082			_a621.3815 _bBRO
100			_aBrooks, Douglas
245			_aPCB design guide to via and trace currents and temperatures _cDouglas Brooks, Johannes Adam
260			_aArtech House, _bNorwood, _c2021
300			_axx, 271 pages : _billustrations (some color) ; _c24 cm
505			_tIntroduction and Historical Background _tMaterials Used in PCB; Resistivity and Resistance _tTrace Heating and Cooling _tIPC Curves; _tThermal Simulation Model + _tThermal Simulations _tVia Temperatures _tCurrent Densities in Vias _tThinking Outside the Box _tFusing Currents _tBackground _tFusing Currents _tAnalyses _tDo Traces Heat Uniformly _tRelevance of Current Density _tAC Currents _tIndustrial CT Scanning
650			_aPrinted circuits Design and construction
650			_aVia (Electricity)
700			_aAdam, Johannes
942			_2ddc _cBK
999			_c1761 _d1761