TY  - BOOK
AU  - Blackwell, Glenn R. [ed.]
AU  - Blackwell,Glenn R.
TI  - The electronic packaging handbook
SN  - 0849385911 
AV  - TK7870.15 .E4233 2000
U1  - 621.3810 21
PY  - 2000///
CY  - Boca Raton, FL
PB  - CRC Press, IEEE Press
KW  - Electronic packaging
KW  - Handbooks, manuals, etc
N1  - Includes bibliographical references and index; Fundamentals of the Design Process
; Surface Mount Technology
; Integrated Circuit Packages
; Direct Chip Attach
; Circuit Boards
; EMC and Printed Circuit Board Design
; Hybrid Assemblies
; Interconnects
; Design for Test
; Adhesive and Its Application
; Thermal Management
; Testing
; Inspection
; Package/Enclosure
; Electronics Package Reliability and Failure; Analysis: A Micromechanics-Based Approach; Product Safety and Third-Party Certification

N2  - The packaging of electronic systems and devices represents a serious challenge for designers managers. A major new entry in the Electrical Engineering series, The Electronic Packaging Handbook provides essential information on the design and packaging of electronic devices and systems. The book is valuable to engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products. Topics covered include design automated new IC packaging technologies, materials, testing, and safety issues
UR  - http://www.loc.gov/catdir/enhancements/fy0731/99041244-d.html
ER  -