TY  - BOOK
AU  - Rao R. Tummala
TI  -  Fundamentals of microsystems packaging
SN  - 9780071371698
U1  - 621.381 
PY  - 2001///
CY  -  New York
PB  - McGraw-Hill's AccessEngineering
N1  - Introduction to microsystems packaging
Role of packaging in microelectronics
Role of packaging in microsystems
Fundamentals of electrical package design
Fundamentals of design for reliability
Fundamentals of thermal management
Fundamentals of single chip packaging
Fundamentals of multichip packaging
Fundamentals of IC assembly
Fundamentals of wafer-level packaging
Fundamentals of passives: discrete, integrated, and embedded
Fundamentals of optoelectronics
Fundamentals of RF packaging
Fundamentals of microelectromechanical systems
Fundamentals of sealing and encapsulation
Fundamentals of system-level PWB technologies
Fundamentals of board assembly
Fundamentals of packaging materials and processes
Fundamentals of electrical testing
Fundamentals of packaging manufacturing
Fundamentals of microsystems design for environment
Fundamentals of microsystems reliability
N2  - A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapte
ER  -