TY  - BOOK
AU  -  John H. Lau
TI  - Electronic Packaging: Design, Materials, Process, and Reliability
SN  - 9780070371354
U1  - 621.381 
PY  - 1998///
CY  - U.S
PB  - McGraw-Hill Professional
KW  -  DESIGN ELECTRONIC EQUIPMENT ELECTRONIC PACKAGING Electronic packaging MATERIALS
N1  - Electrical design; analysis and measurement of electronic packaging and interconnections; basic electrical effects; transmission line behaviour; power and ground bus disturbances; design examples; thermal design, analysis and measurement of electronics packaging and interconnections; principles of heat transfer; thermal analysis and design; hardware components for cooling; measurement perspectives; mechanical design, analysis and measurement; thermal strains; mechanical strains; BGA; SCP; Flip Chip; materials and processes for electronics packaging and interconnection

N2  - Intended to be an electronic packaging resource, this text features writing from four leaders in the the four intertwined disciplines of packaging. Recent technological advances are discussed, including BGA, Flip Chip and CSP
ER  -