John H. Lau <br/><br/>
Electronic Packaging: Design, Materials, Process, and Reliability 
John H. Lau 
 - U.S  McGraw-Hill Professional  1998 
 - 498 p 
<br/><br/> Electrical design; analysis and measurement of electronic packaging and interconnections; basic electrical effects; transmission line behaviour; power and ground bus disturbances; design examples; thermal design, analysis and measurement of electronics packaging and interconnections; principles of heat transfer; thermal analysis and design; hardware components for cooling; measurement perspectives; mechanical design, analysis and measurement; thermal strains; mechanical strains; BGA; SCP; Flip Chip; materials and processes for electronics packaging and interconnection.<br/> 
<br/><br/> Intended to be an electronic packaging resource, this text features writing from four leaders in the the four intertwined disciplines of packaging. Recent technological advances are discussed, including BGA, Flip Chip and CSP. 
<br/><br/><label>ISBN: </label>9780070371354 
<br/><br/><label>Subjects--Topical Terms: </label><br/> DESIGN ELECTRONIC EQUIPMENT ELECTRONIC PACKAGING Electronic packaging MATERIALS
<br/><br/><label>Dewey Class. No.: </label>621.381  / LAU