Advanced electronic packaging Richard K. Ulrich, William D. Brown
Material type:![Text](/opac-tmpl/lib/famfamfam/BK.png)
- 9780471466093
- 621.381 ULR
Item type | Current library | Collection | Call number | Status | Date due | Barcode |
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IIITDM Kurnool Reference | Reference | 621.381 ULR (Browse shelf(Opens below)) | Not For Loan | 0005678 |
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621.381 SAT Handbook of nanophysics. Nanoelectronics and nanophotonics | 621.381 SCH Practical electronics for inventors / | 621.381 STR Solid state electronic devices | 621.381 ULR Advanced electronic packaging | 621.3815 ARC PCB design for real-world EMI control / | 621.3815 MAY Fundamentals of semiconductor manufacturing and process control / | 621.382 HAN Fundamentals of nanoelectronics |
CIRCUITS
Electronic packaging
MICROELECTRONICS
MICROMODULES
Microelectronic packaging
"As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department."--Publisher's website
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