Intro; Title Page; Copyright Page; Contents; Preface; Exordium; Introduction; Chapter 1 The EMC Basic Knowledge and the Essence of the EMC Test; 1.1 What Is EMC?; 1.2 Conduction, Radiation, and Transient; 1.3 Theoretical Basis; 1.3.1 Time Domain and Frequency Domain; 1.3.2 The Concept of the Unit for Electromagnetic Disturbance, dB; 1.3.3 The True Meaning of Decibel; 1.3.4 Electric Field, Magnetic Field, and Antennas; 1.3.5 Resonance of the RLC Circuit; 1.4 Common Mode and Differential Mode in the EMC Domain; 1.5 Essence of the EMC Test; 1.5.1 Essence of the Radiated Emission Test 1.5.2 Essence of the Conducted Emission Test1.5.3 Essence of the ESD Immunity Test; 1.5.4 Essence of the Radiated Immunity Test; 1.5.5 Essence of the Common-Mode Conducted Immunity Test; 1.5.6 Essence of the Differential-Mode Conducted Immunity Test; 1.5.7 Differential-Mode and Common-Mode Hybrid Conducted Immunity Test; Chapter 2 Architecture, Shielding, and Grounding Versus EMC of the Product; 2.1 Introduction; 2.1.1 Architecture Versus EMC of the Product; 2.1.2 Shielding Versus EMC of the Product; 2.1.3 Grounding Versus EMC of the Product; 2.2 Analyses of Related Cases 2.2.1 Case 1: The Conducted Disturbance and the Grounding2.2.2 Case 2: The Ground Loop During the Conducted Emission Test; 2.2.3 Case 3: Where the Radiated Emission Outside the Shield Comes From; 2.2.4 Case 4: The "Floating" Metal and the Radiation; 2.2.5 Case 5: Radiated Emission Caused by the Bolt Extended Outside the Shield; 2.2.6 Case 6: The Compression Amount of the Shield and Its Shielding Effectiveness; 2.2.7 Case 7: The EMI Suppression Effectiveness of the Shielding Layer Between the Transformer's Primary Winding and Secondary Winding in the Switching-Mode Power Supply 2.2.8 Case 8: Bad Contact of the Metallic Casing and System Reset2.2.9 Case 9: ESD Discharge and the Screw; 2.2.10 Case 10: Heatsink Also Affects the ESD Immunity; 2.2.11 Case 11: How Grounding Benefits EMC Performance; 2.2.12 Case 12: The Heatsink Shape Affects Conducted Emissions from the Power Ports; 2.2.13 Case 13: The Metallic Casing Oppositely Causes the EMI Test Failed; 2.2.14 Case 14: Whether Directly Connecting the PCB Reference Ground to the Metallic Casing Will Lead to ESD 2.2.15 Case 15: How to Interconnect the Digital Ground and the Analog Ground in the Digital-Analog Mixed DevicesChapter 3 EMC Issues with Cables, Connectors, and Interface Circuits; 3.1 Introduction; 3.1.1 Cable Is the Weakest Link in the System; 3.1.2 The Interface Circuit Provides Solutions to the Cable Radiation Problem; 3.1.3 Connectors Are the Path Between the Interface Circuit and the Cable; 3.1.4 The Interconnection Between the PCBs Is the Weakest Link of the Product EMC; 3.2 Analyses of Related Cases; 3.2.1 Case 16: The Excessive Radiation Caused by the Cabling