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PCB design guide to via and trace currents and temperatures Douglas Brooks, Johannes Adam

By: Contributor(s): Material type: TextTextPublication details: Artech House, Norwood, 2021Description: xx, 271 pages : illustrations (some color) ; 24 cmISBN:
  • 9781630818609
Subject(s): DDC classification:
  • 621.3815 BRO
Contents:
Introduction and Historical Background Materials Used in PCB; Resistivity and Resistance Trace Heating and Cooling IPC Curves; Thermal Simulation Model + Thermal Simulations Via Temperatures Current Densities in Vias Thinking Outside the Box Fusing Currents Background Fusing Currents Analyses Do Traces Heat Uniformly Relevance of Current Density AC Currents Industrial CT Scanning
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Introduction and Historical Background Materials Used in PCB; Resistivity and Resistance Trace Heating and Cooling IPC Curves; Thermal Simulation Model + Thermal Simulations Via Temperatures Current Densities in Vias Thinking Outside the Box Fusing Currents Background Fusing Currents Analyses Do Traces Heat Uniformly Relevance of Current Density AC Currents Industrial CT Scanning

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