Electronic Packaging: Design, Materials, Process, and Reliability (Record no. 2374)
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000 -LEADER | |
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fixed length control field | 01351nam a22001817a 4500 |
005 - DATE AND TIME OF LATEST TRANSACTION | |
control field | 20240827110227.0 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 240827b |||||||| |||| 00| 0 eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
International Standard Book Number | 9780070371354 |
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
Classification number | 621.381 |
Item number | LAU |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | John H. Lau |
245 ## - TITLE STATEMENT | |
Title | Electronic Packaging: Design, Materials, Process, and Reliability |
Statement of responsibility, etc. | John H. Lau |
260 ## - PUBLICATION, DISTRIBUTION, ETC. | |
Place of publication, distribution, etc. | U.S |
Name of publisher, distributor, etc. | McGraw-Hill Professional |
Date of publication, distribution, etc. | 1998 |
300 ## - PHYSICAL DESCRIPTION | |
Page number | 498 p |
505 ## - FORMATTED CONTENTS NOTE | |
Title | Electrical design; analysis and measurement of electronic packaging and interconnections; basic electrical effects; transmission line behaviour; power and ground bus disturbances; design examples; thermal design, analysis and measurement of electronics packaging and interconnections; principles of heat transfer; thermal analysis and design; hardware components for cooling; measurement perspectives; mechanical design, analysis and measurement; thermal strains; mechanical strains; BGA; SCP; Flip Chip; materials and processes for electronics packaging and interconnection.<br/> |
520 ## - SUMMARY, ETC. | |
Summary, etc. | Intended to be an electronic packaging resource, this text features writing from four leaders in the the four intertwined disciplines of packaging. Recent technological advances are discussed, including BGA, Flip Chip and CSP. |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | DESIGN ELECTRONIC EQUIPMENT ELECTRONIC PACKAGING Electronic packaging MATERIALS |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Source of classification or shelving scheme | Dewey Decimal Classification |
Koha item type | Books |
952 ## - LOCATION AND ITEM INFORMATION (KOHA) | |
-- | 7230 |
Withdrawn status | Lost status | Source of classification or shelving scheme | Damaged status | Not for loan | Collection code | Home library | Current library | Shelving location | Date acquired | Source of acquisition | Cost, normal purchase price | Inventory number | Total Checkouts | Full call number | Barcode | Date last seen | Cost, replacement price | Price effective from | Currency | Koha item type |
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Dewey Decimal Classification | Not For Loan | Reference | IIITDM Kurnool | IIITDM Kurnool | ELECTRONICS COMMUNICATION ENGINEERING | 27.08.2024 | New India Book Agency | 367.00 | 5316 dt 16/7/2024 | 621.381 LAU | 0006196 | 27.08.2024 | 367.00 | 27.08.2024 | USD | Reference |